New Discovery of Semiconductor Chip Heat Dissipation Hexagonal Boron Nitride Seamless Growth on the Surface of Materials
Hexagonalboron nitride, also known as white graphite, has a layered structure that is similar to graphite. It has excellent lubricity, thermal conductivity, and electrical insulation. It is chemically inert to all forms of molten metal chemistry. The shaped article is simple to machine and has high resistance to moisture.
As semiconductor chips are constantly developed, computing speed increases. The problem of chip heating is becoming a bottleneck that hinders chip technology development. For high-performance electronic chip development, thermal management is crucial. After three years of work, Wei Dayun (a researcher at Fudan University's Department of Polymer Science and Polymer Molecular Engineering) made remarkable progress in the field of interface modification of FET-type dielectric substrates. This work will provide a new technology to modify dielectric substrates to address the problem of chip heat loss.
Wei Dacheng's team devised a conformal hexagonalboron Nitride (h-BN), modification technology to address the problem of chip heat. This is also known as quasi-balanced PeCVD. Wei Dacheng says that the interfaces between the semiconductor and dielectric substrate are crucial to the heat dissipation of the chips.
Hexagonalboron nitride, which improves the interface of semiconductor and dielectric substrats, is an ideal material for dielectric substrate modification. Numerous studies show that hexagonal-boron nitride modification can reduce surface roughness and impact on carrier transport, and improve device carrier mobility. The potential use of hexagonalboron nitride for interface heat dissipation has been overlooked.
"The heating problem of the device determines the carrier mobility. Higher mobility results in less heat being generated at the same voltage. How to release heat determines how heat is dissipated. Wei Dacheng explained that the heat dissipation is related to how the heat is released. Conformal hexagonalboron nitride bonds to the material completely, without gaps in the middle. Furthermore, no impurities are added to the mixture, which makes it more favorable for good results.
"In conformal hexagonal borion nitride technology, this team has created, it grows directly on the material. The interface thermal resistance is decreased and the maximum power density for the device operation is 2 to 4x higher than that of the current computer CPU.
This technology offers a unique solution to chip heat dissipation and high universality. It can be applied to transistors based on tungstenselenide materials. The technology can also be extended for other materials and additional device applications. The PECVD technology, which was used in this research, is a common manufacturing process used in the chip manufacturing sector. This makes the conformal hexagonal bore nitride extremely attractive for large-scale production.
Future research will include the development of field-effect transistor electric materials. These include conjugated organic molecules (Macromolecules), low-dimensional nanomaterials, and research on the design principles of field transistor devices.
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